|
October 4, Morrisville, NC- Lambda Technologies’ patented Variable Frequency Microwave (VFM) technology
allows significantly faster curing of standard, off-the-shelf, polymeric
adhesives and coatings used to encapsulate electronic components or die
attach them to circuit boards, while eliminating the hot spots and arcing associated with
conventional microwave technology. Curing processes are typically
accomplished using a convection oven or UV light source, but can also be
done using Variable Frequency Microwave. Commonly, VFM has been used in
the advanced packaging and assembly applications which include cavity dam
& fill, glob top, BGA and flip chip underfill for die attach, wafer
processing, chip-on-board/direct chip attach and now optical component
and fiber optic assemblies.
VFM is being used
in ferrule attach, fiber array attach, VCSEL assembly, transceiver
devices and DWDM-to-fiber block assembly processing. It has been realized
that VFM’s ability to selectively heat adhesive areas while minimizing
coefficient of thermal expansion mismatch between the die, substrate and
adhesive can enable cure of adhesives quickly and uniformly. In addition
selective heating prevents damage to the fiber, jacketing and associated
shielding by heating the adhesive exclusively. On the other hand,
convective heating cures adhesives from the surface inward heating all
components to the same temperature which ultimately contributes to
component misalignment and stress generation. With VFM’s volumetric
heating it is possible to cure the adhesive up to 10X faster than
convection ovens, which reduces the viscous flow time of the adhesive
thereby reducing part movement. One manufacturer of fiber optic devices
improved their yields to over 90% with the introduction of VFM for their
post-curing, while shortening their post cure time to just two minutes.
“It is an exciting
time for Lambda Technologies and for our customers, as we are often able
to provide immediate and significant results in productivity. The VFM process is providing
manufacturers of optoelectronic components an enabling approach to
optimize their product performance features while at the same time
increasing yields, obtaining higher throughput, and offering the
capability to automate their production cure process”, said Richard
Garard CEO of Lambda Technologies.
|
![]() ![]()
![]() ![]()
![]() ![]()
![]() ![]()
Our MicroCure products are also used within the electronics
industry for the following applications:
Flip
Chip Underfill Cure
Glob-Top and Cavity Dam
& Fill
Structural Bonding of
Electronic Assemblies
Post Mold Cure Die Attach
& Bump Cure
Wafer Level Processes
(Coatings & Encapsulation)
Optoelectronic and Fiber
Optic Devices
|
NEWS FLASH!
Lambda Technologies may have solution for
KILLING ANTHRAX!
Click Here to Learn More
Lambda Technologies releases NEW ! Application Note on Curing
Solutions for Optoelectronics and Fiber Optic Devices
Click
Here to Learn More
INTERESTED IN TESTING YOUR APPLICATIONS WITH VARIABLE
FREQUENCY MICROWAVE?
CLICK
HERE
![]()
![]() ![]()
|
